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Microelectronics Processor Offer Letter

Microelectronics Processor Offer Letter Template
This sample microelectronics processor offer letter shows details such as how to sort recruiter & candidate details, position and duties, and list the proposed contract specs in your letter.
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» Sample for Microelectronics Processor

Dear Candidate:

We are pleased to confirm you have been selected to work for [ company/org. name ] as "microelectronics processor".

Job duties are to:

- Assemble microelectronic semiconductor devices, components, and also subassemblies according to drawings specifications, using microscope, bonding machines, and also handtools, performing any combination of following duties
- Read work orders studies assembly drawings to define operation to be performed
- Observe processed semiconductor wafer under scribing machine microscope aligns scribing tool with markings on wafer
- Adjust scribing machine controls, according to work order specifications, and also presses switch to start scribing
- Remove scribed wafer breaks wafer into dice chips , using probe
- Place dice under microscope, visually examines dice for defects, according to procedures, and also rejects defective dice
- Position mounting device on holder under bonding machine microscope, and also adjusts bonding machine controls according to work order specifications
- Position die chip on mounting surface according to diagram
- Press switch on bonding machine to bond die to mounting surface
- Place mounted die into holding fixture under microscope of lead bonding machine
- Adjust bonding machine controls according to work order specifications
- View die as well as moves controls to align position bonding head for lead bonding according to diagram
- Press switch to bond lead as well as moves bonding head to points indicated in bonding diagram to attach route leads as illustrated
- Insert as well as seals unprotected assembly into designated assembly container device, using welding machine plus epoxy syringe, to protect microelectronic assembly complete device, component, or subassembly package
- Examine tests assembly at various stages of production, using microscope, go-not-go test equipment, measuring instruments, pressure-vacuum tanks, and also related devices, according to standard procedures, to detect nonstandard or defective assemblies
- Reject or routes nonstandard components for rework
- Clean parts as well as assemblies at various stages of production, using cleaning devices equipment
- Maintain records of production defects
- Bond multiple dice to headers or other mounting devices
- Important variations are kinds of equipment used, like thermal compression, wedge, wire ball, and also wobble bonders, items assembled, or procedure performed.

Financial Offer:

A) [ basic salary ]: the offered microelectronics processor position is at a [ salary/wage ]... of [ salary/rate per hour ] per [ period in year/month/ week or hour ].
B) [ compensations and benefits ]: your position compensations and benefits are: [ group insurance, dental care, health care, and transportation ],

Further information about the work:

A) [ reporting ]: you will report to [ supervisor job title ]
B) [ work hours ]: your working hours will start from [ start of working day time ] till [ end of working day time ]
C) [ vacations ]: your vacation is 2 days per week

We are delighted to send you this offer to be approved and signed from you in order to start the job from [ starting date ].

We look forward to join our company in order to work with you

[ Recruiter signature ]

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