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Electronic Components - Occupations Duties

View related occupations duties grouped under the 'electronic components' business sector.
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Assembler Semiconductor Occupation

Job Duties:

  • Assemble microelectronic semiconductor devices, components, and subassemblies according to drawings specifications, using microscope, bonding machines, and handtools, performing any combination of following duties
  • Read work orders studies assembly drawings to define operation to be performed
  • Observe processed semiconductor wafer under scribing machine microscope aligns scribing tool with markings on wafer
  • Adjust scribing machine controls, according to work order specifications, and presses switch to start scribing
  • Remove scribed wafer breaks wafer into dice chips , using probe
  • Place dice under microscope, visually examines dice for defects, according to procedures, and rejects defective dice
  • Position mounting device on holder under bonding machine microscope, and adjusts bonding machine controls according to work order specifications
  • Position die chip on mounting surface according to diagram
  • Press switch on bonding machine to bond die to mounting surface
  • Place mounted die into holding fixture under microscope of lead bonding machine
  • Adjust bonding machine controls according to work order specifications
  • View die and moves controls to align position bonding head for lead bonding according to diagram
  • Press switch to bond lead and moves bonding head to points indicated in bonding diagram to attach route leads as illustrated
  • Insert and seals unprotected assembly into designated assembly container device, using welding machine and epoxy syringe, to protect microelectronic assembly complete device, component, or subassembly package
  • Examine tests assembly at various stages of production, using microscope, go-not-go test equipment, measuring instruments, pressure-vacuum tanks, and related devices, according to standard procedures, to detect nonstandard or defective assemblies
  • Reject or routes nonstandard components for rework
  • Clean parts and assemblies at various stages of production, using cleaning devices equipment
  • Maintain records of production defects
  • Bond multiple dice to headers or other mounting devices
  • Important variations are kinds of equipment used, like thermal compression, wedge, wire ball, and wobble bonders, items assembled, or procedure performed.

Automated Process Operator Occupation

Job Duties:

  • Operate mechanical units of automated production machinery to produce deposited carbon resistors for use in electronic equipment
  • Turn valves to admit methane and nitrogen gases into carbon-coating furnace sets furnace temperature for computer control according to work order
  • Press buttons & turns valves to start vacuum pump of terminating chambers set rate for back-filling chambers with argon gas, preparatory to sputtering gold contacts on carbonized ceramic cores
  • Sets thermostats to heat curing oven of encapsulating machine water vat of air-leak detection unit to specified temperatures
  • Turn valve to spray water over resistors emerging from curing oven
  • Observe temperature gauges, pressure gauges, and machine operation to detect mechanical failures in automated machinery
  • Notify Maintenance Mechanic any industry 638.281-014 of machinery malfunction.

Beveler Printed Circuit Boards Occupation

Job Duties:

  • Operate machine to bevel printed circuit board Pcb connectors
  • Read work order to define specified angle depth of bevel
  • Turn knobs to adjust machine cutting tool
  • Slide Pcb along guide over cutting tool to bevel Pcb connector
  • View beveled edge of sample board connector through magnifying scope to verify angle depth of cut meet company specifications
  • Operate machine to bevel all connector edges
  • Inspect Pcbs to detect rough edges, dirty surfaces, and closed holes
  • Smooth rough edges, using hand file
  • Clean dust deposits from Pcb, using airhose, toothbrush, or rag
  • Scrape excess plating from holes, using utility knife.

Black Oxide Coating Equipment Tender Occupation

Job Duties:

  • Tend computerized equipment that applies black oxide coating to printed circuit board Pcb panels to prevent electrical contact between layers to aid adhesion of layers of multilayer Pcbs
  • Load Pcb panels into racks positions racks under equipment crane
  • Push button to activate crane that automatically lifts racks of panels immerses racks into series of tanks that coat panels with black oxide
  • Measure temperature of solutions with pyrometer and turns equipment knobs and valves to adjust temperature regulate liquid volume
  • Place panels in oven to dry.

Black Oxide Operator Occupation

Job Duties:

  • Tend computerized equipment that applies black oxide coating to printed circuit board Pcb panels to prevent electrical contact between layers to aid adhesion of layers of multilayer Pcbs
  • Load Pcb panels into racks positions racks under equipment crane
  • Push button to activate crane that automatically lifts racks of panels immerses racks into series of tanks that coat panels with black oxide
  • Measure temperature of solutions with pyrometer and turns equipment knobs and valves to adjust temperature regulate liquid volume
  • Place panels in oven to dry.

Bonder Semiconductor Occupation

Job Duties:

  • Tend automatic bonding machine that bonds gold or aluminum wire to integrated circuit dies to connect circuitry to package leads
  • Review schematic diagram or work order to define bonding specifications
  • Turn dials to set bonding machine temperature controls to regulate wire feeding mechanism
  • Mount spool of wire onto holder inserts wire end through guides, using tweezers
  • Position semiconductor package into magazine of automatic feed mechanism, and observes package, using microscope or equipment display screen, to make sure connections to be bonded are aligned with bonding wire
  • Adjust alignment as necessary
  • Activate machine that automatically bonds wire to specified connections on semiconductor package leads
  • Remove packages from bonding machine places packages in work tray
  • May test tensile strength of bonded connections, using testing equipment
  • May locate connections bond wire to connect circuitry of hybrid circuits, using precision-bonding machine.

Break and load Operator Occupation

Job Duties:

  • Tend machine that breaks resistor plates along previously scored lines loads resistors into magazines for further processing
  • Attach guides of specified size to track on machine that feeds resistors into magazine, using allen wrench
  • Snap magazine onto machine
  • Break scrap edges from plates
  • Place plates into feed mechanism of machine starts machine that automatically breaks plates into columns of resistors which slide down track
  • Taps column of resistors at bottom of track, using plastic rod, to break column into single resistors that fall into magazine
  • Clear machine jams, using plastic rod or tweezers
  • Break plates by hand to remove premarked, defective resistors
  • Fill out job order production report
  • Clean machine work station, using brush
  • Carry magazines to storage room picks up box of plates for next work order.

Cathode Ray Tube Assembler Occupation

Job Duties:

  • Perform any combination of following tasks to assemble cathode-ray tubes used in television display equipment
  • Remove funnel from rack places funnel onto conveyorized washing, rinsing and drying equipment
  • Position funnel in rotatable holding chuck to secure funnel for painting
  • Insert brush into rotating funnel paints dag conductive graphite coating as indicated by chuck guide to provide electric conductivity
  • Verify that aperture mask display screen fit together according to corresponding numbers
  • Examine aperture mask screen in light box to detect misaligned color dots, using microscope
  • Position funnel in rotatable chuck equipped with automatic frit dispenser
  • Move controls that index frit dispenser around edge of funnel mouth to dispense sealant
  • Remove frit-coated funnel from chuck secures funnel in jig for joining display screen assembly onto funnel
  • Position display screen assembly on funnel edge aligns screen with reference points on funnel
  • Push jig onto conveyor leading into oven to fuse funnel display screen assembly into bulb
  • Place bulb on holding fixture of sprayer to coat interior surface of bulb with protective layer of lacquer
  • Place bulb onto holding fixture of evaporation equipment to apply aluminized coating to interior surface of bulb
  • Place bulb onto conveyor that carries bulb through processing stations to preheat bulb, insert and fuse gun to neck of bulb to form tube, and anneals cools tube assembly
  • Place tube onto cart or conveyor for further processing
  • Inspect tube for imperfections, like blemishes, coating defects, scratches, bubbles, or stains, using magnifier, ultraviolet light, inspection booth, or unaided vision
  • May be designated according to duties performed as Aluminizer electron
  • comp. , Bulb Assembler electron
  • comp. , Dag Coater electron
  • comp. , Frit Coater electron
  • comp. , Funnel Coater electron comp. , Gun-Sealing-Machine Operator electron
  • comp. , Lacquer Sprayer electron

Cathode Ray Tube Salvage Processor Occupation

Job Duties:

  • Perform any combination of following duties to disassemble salvaged cathode ray tubes for reprocessing
  • Remove vacuum electron gun from bulb of salvaged cathode ray tube, using portable air drill
  • Place bulb on fixture of deband machine & activates machine that cuts metal band that surrounds joint between funnel viewing screen of bulb
  • Place debanded bulb on conveyor that carries bulb through series of acid and water baths to loosen dissolve frit that bonds funnel to viewing screen
  • Position bulb on chuck of machine presses pedal on machine that pneumatically separates funnel from viewing screen
  • Place funnel and screen in vats of acid water to remove remaining frit from parts
  • Examine funnel screen to make sure all frit was removed during acid processing
  • Place funnel screen on cart for further processing.

Ceramic Capacitor Processor Occupation

Job Duties:

  • Perform any combination of following tasks to process substrate, electrode, and termination materials to form monolithic ceramic capacitors
  • Review work orders production schedules to define processing specifications
  • Deposit layer of dielectric ceramic material on thermoplastic sheets, using tape casting equipment
  • Cuts cast sheets into ceramic wafers
  • Verify and sorts wafers according to thickness and quality, using thickness gauge magnifying device
  • Deposit electrode material onto wafers, using silk screen printing machine
  • Heat compresses stacks of imprinted, ceramic wafers to form laminates, using laminating press
  • Cuts laminate into chips, using bench-mounted cutting equipment or automatic cutter
  • Load chips onto boat fires chips in kiln to fuse laminated material
  • Apply conductive termination material to specified edges of ceramic chips, manually or using automatic dipping equipment
  • Fuse conductive termination material to ceramic chip, using automatic oven
  • Polish fused chip, using tumbler
  • Solder lead wires to ceramic chip, manually or using automatic soldering machine
  • Encase capacitors in epoxy material.



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