Electronic Components - Occupations Duties

Assembler Semiconductor Occupation

Job Duties:

• Assemble microelectronic semiconductor devices, components, and subassemblies according to drawings specifications, using microscope, bonding machines, and handtools, performing any combination of following duties
• Read work orders studies assembly drawings to define operation to be performed
• Observe processed semiconductor wafer under scribing machine microscope aligns scribing tool with markings on wafer
• Adjust scribing machine controls, according to work order specifications, and presses switch to start scribing
• Remove scribed wafer breaks wafer into dice chips , using probe
• Place dice under microscope, visually examines dice for defects, according to procedures, and rejects defective dice
• Position mounting device on holder under bonding machine microscope, and adjusts bonding machine controls according to work order specifications
• Position die chip on mounting surface according to diagram
• Press switch on bonding machine to bond die to mounting surface
• Place mounted die into holding fixture under microscope of lead bonding machine
• Adjust bonding machine controls according to work order specifications
• View die and moves controls to align position bonding head for lead bonding according to diagram
• Press switch to bond lead and moves bonding head to points indicated in bonding diagram to attach route leads as illustrated
• Insert and seals unprotected assembly into designated assembly container device, using welding machine and epoxy syringe, to protect microelectronic assembly complete device, component, or subassembly package
• Examine tests assembly at various stages of production, using microscope, go-not-go test equipment, measuring instruments, pressure-vacuum tanks, and related devices, according to standard procedures, to detect nonstandard or defective assemblies
• Reject or routes nonstandard components for rework
• Clean parts and assemblies at various stages of production, using cleaning devices equipment
• Maintain records of production defects
• Bond multiple dice to headers or other mounting devices
• Important variations are kinds of equipment used, like thermal compression, wedge, wire ball, and wobble bonders, items assembled, or procedure performed.

Automated Process Operator Occupation

Job Duties:

• Operate mechanical units of automated production machinery to produce deposited carbon resistors for use in electronic equipment
• Turn valves to admit methane and nitrogen gases into carbon-coating furnace sets furnace temperature for computer control according to work order
• Press buttons & turns valves to start vacuum pump of terminating chambers set rate for back-filling chambers with argon gas, preparatory to sputtering gold contacts on carbonized ceramic cores
• Sets thermostats to heat curing oven of encapsulating machine water vat of air-leak detection unit to specified temperatures
• Turn valve to spray water over resistors emerging from curing oven
• Observe temperature gauges, pressure gauges, and machine operation to detect mechanical failures in automated machinery
• Notify Maintenance Mechanic any industry 638.281-014 of machinery malfunction.

Beveler Printed Circuit Boards Occupation

Job Duties:

• Operate machine to bevel printed circuit board Pcb connectors
• Read work order to define specified angle depth of bevel
• Turn knobs to adjust machine cutting tool
• Slide Pcb along guide over cutting tool to bevel Pcb connector
• View beveled edge of sample board connector through magnifying scope to verify angle depth of cut meet company specifications
• Operate machine to bevel all connector edges
• Inspect Pcbs to detect rough edges, dirty surfaces, and closed holes
• Smooth rough edges, using hand file
• Clean dust deposits from Pcb, using airhose, toothbrush, or rag
• Scrape excess plating from holes, using utility knife.

Black Oxide Coating Equipment Tender Occupation

Job Duties:

• Tend computerized equipment that applies black oxide coating to printed circuit board Pcb panels to prevent electrical contact between layers to aid adhesion of layers of multilayer Pcbs
• Load Pcb panels into racks positions racks under equipment crane
• Push button to activate crane that automatically lifts racks of panels immerses racks into series of tanks that coat panels with black oxide
• Measure temperature of solutions with pyrometer and turns equipment knobs and valves to adjust temperature regulate liquid volume
• Place panels in oven to dry.

Black Oxide Operator Occupation

Job Duties:

• Tend computerized equipment that applies black oxide coating to printed circuit board Pcb panels to prevent electrical contact between layers to aid adhesion of layers of multilayer Pcbs
• Load Pcb panels into racks positions racks under equipment crane
• Push button to activate crane that automatically lifts racks of panels immerses racks into series of tanks that coat panels with black oxide
• Measure temperature of solutions with pyrometer and turns equipment knobs and valves to adjust temperature regulate liquid volume
• Place panels in oven to dry.

Bonder Semiconductor Occupation

Job Duties:

• Tend automatic bonding machine that bonds gold or aluminum wire to integrated circuit dies to connect circuitry to package leads
• Review schematic diagram or work order to define bonding specifications
• Turn dials to set bonding machine temperature controls to regulate wire feeding mechanism
• Mount spool of wire onto holder inserts wire end through guides, using tweezers
• Position semiconductor package into magazine of automatic feed mechanism, and observes package, using microscope or equipment display screen, to make sure connections to be bonded are aligned with bonding wire
• Adjust alignment as necessary
• Activate machine that automatically bonds wire to specified connections on semiconductor package leads
• Remove packages from bonding machine places packages in work tray
• May test tensile strength of bonded connections, using testing equipment
• May locate connections bond wire to connect circuitry of hybrid circuits, using precision-bonding machine.

Break and load Operator Occupation

Job Duties:

• Tend machine that breaks resistor plates along previously scored lines loads resistors into magazines for further processing
• Attach guides of specified size to track on machine that feeds resistors into magazine, using allen wrench
• Snap magazine onto machine
• Break scrap edges from plates
• Place plates into feed mechanism of machine starts machine that automatically breaks plates into columns of resistors which slide down track
• Taps column of resistors at bottom of track, using plastic rod, to break column into single resistors that fall into magazine
• Clear machine jams, using plastic rod or tweezers
• Break plates by hand to remove premarked, defective resistors
• Fill out job order production report
• Clean machine work station, using brush
• Carry magazines to storage room picks up box of plates for next work order.

Cathode Ray Tube Assembler Occupation

Job Duties:

• Perform any combination of following tasks to assemble cathode-ray tubes used in television display equipment
• Remove funnel from rack places funnel onto conveyorized washing, rinsing and drying equipment
• Position funnel in rotatable holding chuck to secure funnel for painting
• Insert brush into rotating funnel paints dag conductive graphite coating as indicated by chuck guide to provide electric conductivity
• Verify that aperture mask display screen fit together according to corresponding numbers
• Examine aperture mask screen in light box to detect misaligned color dots, using microscope
• Position funnel in rotatable chuck equipped with automatic frit dispenser
• Move controls that index frit dispenser around edge of funnel mouth to dispense sealant
• Remove frit-coated funnel from chuck secures funnel in jig for joining display screen assembly onto funnel
• Position display screen assembly on funnel edge aligns screen with reference points on funnel
• Push jig onto conveyor leading into oven to fuse funnel display screen assembly into bulb
• Place bulb on holding fixture of sprayer to coat interior surface of bulb with protective layer of lacquer
• Place bulb onto holding fixture of evaporation equipment to apply aluminized coating to interior surface of bulb
• Place bulb onto conveyor that carries bulb through processing stations to preheat bulb, insert and fuse gun to neck of bulb to form tube, and anneals cools tube assembly
• Place tube onto cart or conveyor for further processing
• Inspect tube for imperfections, like blemishes, coating defects, scratches, bubbles, or stains, using magnifier, ultraviolet light, inspection booth, or unaided vision
• May be designated according to duties performed as Aluminizer electron
• comp. , Bulb Assembler electron
• comp. , Dag Coater electron
• comp. , Frit Coater electron
• comp. , Funnel Coater electron comp. , Gun-Sealing-Machine Operator electron
• comp. , Lacquer Sprayer electron

Cathode Ray Tube Salvage Processor Occupation

Job Duties:

• Perform any combination of following duties to disassemble salvaged cathode ray tubes for reprocessing
• Remove vacuum electron gun from bulb of salvaged cathode ray tube, using portable air drill
• Place bulb on fixture of deband machine & activates machine that cuts metal band that surrounds joint between funnel viewing screen of bulb
• Place debanded bulb on conveyor that carries bulb through series of acid and water baths to loosen dissolve frit that bonds funnel to viewing screen
• Position bulb on chuck of machine presses pedal on machine that pneumatically separates funnel from viewing screen
• Place funnel and screen in vats of acid water to remove remaining frit from parts
• Examine funnel screen to make sure all frit was removed during acid processing
• Place funnel screen on cart for further processing.

Ceramic Capacitor Processor Occupation

Job Duties:

• Perform any combination of following tasks to process substrate, electrode, and termination materials to form monolithic ceramic capacitors
• Review work orders production schedules to define processing specifications
• Deposit layer of dielectric ceramic material on thermoplastic sheets, using tape casting equipment
• Cuts cast sheets into ceramic wafers
• Verify and sorts wafers according to thickness and quality, using thickness gauge magnifying device
• Deposit electrode material onto wafers, using silk screen printing machine
• Heat compresses stacks of imprinted, ceramic wafers to form laminates, using laminating press
• Cuts laminate into chips, using bench-mounted cutting equipment or automatic cutter
• Load chips onto boat fires chips in kiln to fuse laminated material
• Apply conductive termination material to specified edges of ceramic chips, manually or using automatic dipping equipment
• Fuse conductive termination material to ceramic chip, using automatic oven
• Polish fused chip, using tumbler
• Solder lead wires to ceramic chip, manually or using automatic soldering machine
• Encase capacitors in epoxy material.