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Bonder Semiconductor Application Letter

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Bonder Semiconductor Application Letter Template
Bonder Semiconductor Job Application Letter

Dear Ms. Smith,

I'm interested in working for your Segma Int. as resume would be sent upon your request. Listed bellow a brief of my career work experience including duties and responsibilities.

My resume is enclosed for your review. Given my closely Experience:

Job title: Bonder Semiconductor, Company: New Line Inc

Duties and Responsibilities were to:

1) Tend automatic bonding machine that bonds gold or aluminum wire to integrated circuit dies to connect circuitry to package leads

2) Review schematic diagram or work order to define bonding specifications

3) Turn dials to set bonding machine temperature controls to regulate wire feeding mechanism

4) Mount spool of wire onto holder inserts wire end through guides, using tweezers

5) Position semiconductor package into magazine of automatic feed mechanism, and also observes package, using microscope or equipment display screen, to make sure connections to be bonded are aligned with bonding wire

6) Adjust alignment as necessary

7) Activate machine that automatically bonds wire to specified connections on semiconductor package leads

8) Remove packages from bonding machine places packages in work tray

9) May test tensile strength of bonded connections, using testing equipment

10) May locate connections bond wire to connect circuitry of hybrid circuits, using precision-bonding machine.

I do appreciate your time taken to review my application letter.

Thanks And Best Regards

Sincerely,
Flori Rothenberg